AM50-0006
Low Noise Amplifier
1400 - 2000 MHz
Data for 1400 - 1520 MHz Operation
Functional Schematic
VDD
L3
C2
RF
Input
C1
L2
4
L1
3
6
1, 5
2
RF
Output
R1
C3
(See note 10)
Recommended PCB Configuration
Layout View
Pin 1
Rev. V4
External Circuitry Parts List9
Part
Value
Purpose
C1
47 pF
DC Block
C2
470 pF
By-Pass
L1
10 nH
Tuning
L2
3.9 nH
Tuning
L3
22 nH
RF Choke
R1
See note
10
Current control
C3
470 pF
By-Pass
9. All external circuitry parts are readily available, low cost
surface mount components (.060 in. x .030 in. or .080 in.
x .050 in.)
10. Pin 2 allows use of an external resistor to ground for
optional, higher current.
For IDD ~ 5 mA, R1 = 150 ohms;
IDD ~ 6.5 mA, R1 = 120 ohms;
IDD ~ 20 mA, R1 = 27 ohms.
Cross Section View
The PCB dielectric between RF traces and RF ground layers
should be chosen to reduce RF discontinuities between 50 Ω
lines and package pins. M/A-COM recommends an FR-4 di-
electric thickness of 0.008” (0.20 mm) yielding a 50 Ω line width
of 0.015” (0.38 mm). The recommended RF metalization
thickness is 1 ounce copper.
6
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
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Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.