25LC080C-I/ST View Datasheet(PDF) - Microchip Technology

Part Name

Description

MFG CO.

25LC080C-I/ST

8K SPI Bus Serial EEPROM

Microchip Technology 

25XX080C/D

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

X

–

X

/XX

Device Tape & Reel

Temp Range Package

Device:

Tape & Reel:

Temperature

Range:

25AA080C

25AA080D

25LC080C

25LC080D

8 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM

8 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM

8 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM

8 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM

Blank =

T

=

I

=

E

=

Standard packaging

Tape & Reel

-40°C to+85°C

-40°C to+125°C

Examples:

a) 25AA080C-I/MS = 8 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., MSOP

package

b) 25AA080CT-I/SN = 8 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

c) 25LC080DT-I/SN = 8 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

d) 25LC080DT-I/ST = 8 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

TSSOP package

Package:

Note 1:

MS =

P

=

SN =

ST =

MNY(1) =

Plastic MSOP (Micro Small Outline), 8-lead

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (3.90 mm body), 8-lead

TSSOP, 8-lead

8-lead 2x3 mm TDFN

“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.

© 2009 Microchip Technology Inc.

DS22151A-page 25

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