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MT29F4G08ADBDAHCXQS View Datasheet(PDF) - Micron Technology

Part Name
Description
MFG CO.
MT29F4G08ADBDAHCXQS
Micron
Micron Technology 
MT29F4G08ADBDAHCXQS Datasheet PDF : 132 Pages
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Micron Confidential and Proprietary
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory
Feature Operations
Feature Operations
The SET FEATURES (EFh) and GET FEATURES (EEh) commands are used to modify the
target's default power-on behavior. These commands use a one-byte feature address to
determine which subfeature parameters will be read or modified. Each feature address
(in the 00h to FFh range) is defined in below. The SET FEATURES (EFh) command
writes subfeature parameters (P1–P4) to the specified feature address. The GET FEA-
TURES command reads the subfeature parameters (P1–P4) at the specified feature ad-
dress.
When a feature is set, by default it remains active until the device is power cycled. It is
volatile. Unless otherwise specified in the features table, once a device is set it remains
set, even if a RESET (FFh) command is issued. GET/SET FEATURES commands can be
used after required RESET to enable features before system BOOT ROM process.
Internal ECC can be enabled/disabled using SET FEATURES (EFh). The SET FEATURES
command (EFh), followed by address 90h, followed by four data bytes (only the first da-
ta byte is used) will enable/disable internal ECC.
The sequence to enable internal ECC with SET FEATURES is EFh(cmd)-90h(addr)-
08h(data)-00h(data)-00h(data)-00h(data)-wait(tFEAT).
The sequence to disable internal ECC with SET FEATURES is EFh(cmd)-90h(addr)-
00h(data)-00h(data)-00h(data)-00h(data)-wait(tFEAT). The GET FEATURES command
is EEh.
Table 13: Feature Address Definitions
Feature Address
00h
01h
02h–7Fh
80h
81h
82h–FFh
90h
Definition
Reserved
Timing mode
Reserved
Programmable output drive strength
Programmable RB# pull-down strength
Reserved
Array operation mode
PDF: 09005aef83b25735
m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. N 10/12 EN
49
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.

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