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STFPC311 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
STFPC311 Datasheet PDF : 39 Pages
First Prev 31 32 33 34 35 36 37 38 39
15 Package mechanical data
15 Package mechanical data
STFPC311
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.
These packages have a Lead-free second level interconnect. The category of second Level
Interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com.
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