
Data Sheet
January 2002
Package Outline Drawings (continued)
208-Pin SQFP2
Dimensions are in millimeters.
30.60 ± 0.20
28.00 ± 0.20
21.0 REF
PIN #1 IDENTIFIER ZONE
208
1
ORCA Series 2 FPGAs
157
156
21.0
REF
28.00
± 0.20
30.60
± 0.20
52
105
53
104
EXPOSED HEAT SINK APPEARS ON BOTTOM
SURFACE: CHIP BONDED FACE UP (SEE DETAIL C)
DETAIL A
DETAIL B
3.40 ± 0.20
0.50 TYP
0.25 MIN
4.10 MAX
SEATING PLANE
0.08
1.30 REF
0.25
GAGE PLANE
SEATING PLANE
0.50/0.75
DETAIL A
Lattice Semiconductor
0.090/0.200
0.17/0.2
0.10 M
DETAIL B
5-3828.a
179