STM32F103VE View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F103VE

Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces

STMicroelectronics 

STM32F103xC, STM32F103xD, STM32F103xE

Description

2.1

Device overview

Table 2.

STM32F103xC, STM32F103xD and STM32F103xE features and peripheral

counts

Peripherals

STM32F103Rx

STM32F103Vx

STM32F103Zx

Flash memory in Kbytes

SRAM in Kbytes

FSMC

256

384 512 256 384 512 256 384 512

48

64(1)

48

64

48

64

No

Yes(2)

Yes

General-purpose

4

Timers Advanced-control

2

Basic

2

SPI(I2S)(3)

3(2)

I2C

2

USART

5

Comm

USB

1

CAN

1

SDIO

1

GPIOs

51

80

112

12-bit ADC

3

Number of channels

16

3

3

16

21

12-bit DAC

2

Number of channels

2

CPU frequency

72 MHz

Operating voltage

2.0 to 3.6 V

Operating temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 10)

Junction temperature: –40 to + 125 °C (see Table 10)

Package

LQFP64 WLCSP64 LQFP100, BGA100 LQFP144, BGA144

1. 64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.

2. For the LQFP100 and BGA100 packages, only FSMC Bank1 and Bank2 are available. Bank1 can only

support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or

8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is

not available in this package.

3. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the

I2S audio mode.

Doc ID 14611 Rev 7

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