STPCI2GDYI(2002) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STPCI2GDYI
(Rev.:2002)

X86 Core PC Compatible System-on-Chip for Terminals

STMicroelectronics 

MECHANICAL DATA

Figure 5-6. Thermal Dissipation With Heatsink

Board

Ambient

Case

Junction

Board

Ambient

Junction

Rca

3

Rjc

Board

8.5

Rjb

6

Case

50

Rba

Ambient

Rja = 9.5 °C/W

Board dimensions:

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

The PBGA is centred on board

There are no other devices

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Copper thickness:

- 17µm for internal layers

- 34µm for external layers

Airflow = 0

Board temperature taken at the centre balls

Heat sink is 11.1°C/W

Issue 1.0 - July 24, 2002

73/111

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