
PIC16C925/926
68-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD)
E
E1
#leads=n1
W
D1 D
n12
R
CH1 x 45°
A3
A2
c
E2
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Package Thickness
A2
Standoff §
A1
Side One Chamfer Dim.
A3
Corner Chamfer (1)
CH1
Corner Radius (Others)
R
Overall Package Width
E
Overall Package Length
D
Ceramic Package Width
E1
Ceramic Package Length
D1
Footprint Width
E2
Footprint Length
D2
Pins each side
n1
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Window Diameter
W
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-087
Drawing No. C04-097
A
45°
MIN
.165
.118
.030
.030
.030
.020
.983
.983
.942
.942
.890
.890
.008
.026
.015
.370
INCHES*
NOM
68
.050
.175
.137
.040
.035
.040
.025
.988
.988
.950
.950
.910
.910
17
.010
.029
.018
.380
MAX
.185
.155
.050
.040
.050
.030
.993
.993
.958
.958
.930
.930
.012
.031
.021
.390
B1 p
B
A1
D2
MILLIMETERS
MIN
NOM
68
1.27
4.19
4.45
3.00
3.48
0.76
1.02
0.76
0.89
0.76
1.02
0.51
0.64
24.97
25.10
24.97
25.10
23.93
24.13
23.93
24.13
22.61
23.11
22.61
23.11
17
0.20
0.25
0.66
0.72
0.38
0.46
9.40
9.65
MAX
4.70
3.94
1.27
1.02
1.27
0.76
25.22
25.22
24.33
24.33
23.62
23.62
0.30
0.79
0.53
9.91
2001 Microchip Technology Inc.
Preliminary
DS39544A-page 165