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STP12PF06 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
STP12PF06 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
STP12PF06 STF12PF06
Table 4: THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
Rthj-amb Thermal Resistance Junction-ambient
Max
Tl
Maximum Lead Temperature For Soldering Purpose
TO-220
TO-220FP
2.5
5.35 °C/W
62.5
°C/W
300
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
Table 5: OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
60
V
Breakdown Voltage
IDSS
IGSS
Zero Gate Voltage
Drain Current (VGS = 0)
Gate-body Leakage
Current (VDS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
VGS = ± 20V
1
µA
10
µA
±100
nA
Table 6: ON (*)
Symbol
Parameter
VGS(th) Gate Threshold Voltage
RDS(on)
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
ID = 10 A
Min.
2
Typ.
3.4
0.18
Max.
4
0.20
Unit
V
Table 7: DYNAMIC
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
gfs (2)
Forward Transconductance VDS = 15 V
ID = 6 A
2.5
6
S
Ciss
Input Capacitance
VDS = 25V f = 1 MHz VGS = 0
850
pF
Coss
Output Capacitance
230
pF
Crss
Reverse Transfer
75
pF
Capacitance
2/10

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