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LD05AA223KAB1A Datasheet PDF - AVX Corporation

Part NameDescriptionManufacturer
LD05AA223KAB1A High Voltage MLC Chips Tin/Lead Termination “B” For 600V to 5000V Applications AVX
AVX Corporation AVX
LD05AA223KAB1A Datasheet PDF : LD05AA223KAB1A pdf   
LD12SC103KAB1A image

AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages, a full range of values that we are offering in this “B” termination. Larger physical sizes than normally encountered chips are used to make high voltage MLC chip product. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing. For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or SMT configurations (for details see section on high voltage leaded MLC chips).

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