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Part Name(s) : OC100 OC100G OC100HG
VMI
Voltage Multipliers Inc
Description : OptocouplerAxial LeadedEpoxy Molded

OptocouplerAxial LeadedEpoxy Molded
   

Part Name(s) : Z25S Z50S Z100S
VMI
Voltage Multipliers Inc
Description : Axial Leaded Epoxy Molded

2,500 V - 10,000 V Rectifiers

0.60 A - 2.0 A Forward Current
3000 ns Recovery Time

Part Name(s) : IRF-36
Vishay
Vishay Semiconductors
Description : Inductors Epoxy Conformal Coated, Axial Leaded

FEATURES
• High performance ferrite core is used in this Epoxy conformally coated choke which allows for inductance values to 1000µH.
Axial lead type, small lightweight design.
• Special magnetic core structure contributes to high Q and self-resonant frequencies.
• Treated with Epoxy resin coating for humidity resistance to ensure long life.
• Heat resistant adhesives and special structural design for effective open circuit measurement.

Part Name(s) : IRF-24 IRF24ER6R8K
Vishay
Vishay Semiconductors
Description : Inductors Epoxy Conformal Coated, Axial Leaded

FEATURES
• High performance ferrite core is used in this Epoxy conformally coated choke which allows for inductance values to 1000 µH
Axial lead type, small lightweight design
• Special magnetic core structure contributes to high Q and self-resonant frequencies
• Treated with Epoxy resin coating for humidity resistance to ensure long life
• Heat resistant adhesives
 

 

Part Name(s) : K25S K50S K100S
VMI
Voltage Multipliers Inc
Description : High Voltage Diodes - Epoxy Molded

High Voltage Diodes - Epoxy Molded
                                    1.5A - 3.0A • 3000ns • Axial Leaded
   

VMI
Voltage Multipliers Inc
Description : High Voltage Diodes - Epoxy Molded

High Voltage Diodes - Epoxy Molded
   
1.5A - 3.0A • 100ns • Axial Leaded
   

Vishay
Vishay Semiconductors
Description : Inductors Epoxy Conformal Coated, Axial Leaded

FEATURES
Axial lead type, small lightweight design
• Special magnetic core structure contributes to high Q and self-resonant frequencies
• Treated with Epoxy resin coating for humidity resistance to ensure long life
• Heat resistant adhesives and special structural design for effective open circuit measurement

 

Part Name(s) : C640C109JCG5TA
Kemet
KEMET
Description : MULTILAYER CERAMIC CAPACITORS/Axial & RADIAL Leaded

MULTILAYER CERAMIC CAPACITORS/Axial & RADIAL Leaded

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including Leaded devices and surface mounted chips. Leaded styles include Molded and conformally coated parts with Axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on
the intended use.

Part Name(s) : IM02SH27NK40
Vishay
Vishay Semiconductors
Description : Inductors, Commercial, Molded, Axial Leaded

FEATURES
• Wide inductance range in small package
• Flame retardant coating
• Precision performance, excellent reliability, sturdy construction
Epoxy Molded construction provides superior moisture protection
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Description : MULTILAYER CERAMIC CAPACITORS/Axial & RADIAL Leaded

MULTILAYER CERAMIC CAPACITORS/Axial & RADIAL Leaded

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including Leaded devices and surface mounted chips. Leaded styles include Molded and conformally coated parts with Axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure.The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 

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