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Manufacturer Part no Description View
Kemet
KEMET
C617 MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617 PDF
SANYO
SANYO -> Panasonic
C6144 NPN Epitaxial Planar Silicon Transistor

High-Current Switching Applications

Features
• Adoption of MBIT process.
• High current capacitance.
• Low collector-to-emitter saturation voltage.
• High-speed switching.

Applications
• Relay drivers, lamp drivers, motor drivers.
 


other parts : 2SC6144  
C6144 PDF
ETC
Unspecified
C61157-A2-A3 SAW Components IF Filter for Quasi/Split Sound Applications

[EPCOS]

Features
■ TV IF filter for quasi/split sound applications (separate picture and sound channel)
■ Picture channel with Nyquist slope and sound suppression
■ Group delay predistortion
■ Sound channel with passband only for sound carriers at 33,40 MHz and 33,05 MHz (NICAM)
■ Suitable for CENELEC EN 55020


other parts : B39389-G3355-K100  G3355K  F61074-V8068-Z000  
C61157-A2-A3 PDF
Epcos
EPCOS AG
C61157-A2-A4 SAW Components Bandpass Filter

Features
■ IF filter for cordless application
■ Channel selection in DECT system
■ Low group delay ripple
■ Surface Mounted Technology (SMT)
■ Standard IC small outline (SO) package
■ Balanced and unbalanced operation possible

 


other parts : B39111-B8100-L100  B39111B4542Z910  B39111B8100L100  B8100  F61074-V8058-Z000  
C61157-A2-A4 PDF
Epcos
EPCOS AG
C61157-A8-A8 SAW Components SAW Rx filter

SAW Components SAW Rx filter
Automotive telematics

Features
■Package size 1.4 x 1.1 x 0.4 mm3
■Package code QCS5M
■RoHS compatible
■Approximate weight 0.003 g
■Package forSurfaceMountTechnology (SMT)
■Ni, gold-plated terminals
■AEC-Q200 qualified component family (operable temperature range -40˚C to +85˚C)
■Electrostatic SensitiveDevice (ESD)

Application
■Low-loss RF filter for mobile telephone
   WCDMA systems, receive path (RX)
■Impedance transformation from 50Ωto 150Ω
■Unbalanced to balanced operation
■Very low insertion attenuation
■Very high Tx-suppression
■Passband with very low error vector magnitude(EVM)
■Low amplitude ripple
■Very low ripple over any 3.84MHz as well as 5.0MHz within the passband
■Usable passband 60 MHz


other parts : B39212B4302F210  B4302  
C61157-A8-A8 PDF
Kemet
KEMET
C617C103MHG5T MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617C103MHG5T PDF
Kemet
KEMET
C617C103PHG5T MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617C103PHG5T PDF
Kemet
KEMET
C617C103ZHG5T MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617C103ZHG5T PDF
Kemet
KEMET
C617C103PFG5T MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617C103PFG5T PDF
Kemet
KEMET
C617C103ZFG5T MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617C103ZFG5T PDF
Kemet
KEMET
C617C103PCG5T MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617C103PCG5T PDF
Kemet
KEMET
C617C103ZCG5T MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 


other parts : C052/56G  C052/56T  C052C-K-G  C052G  C052T  C056G  C056T  C062/66G  C062/66T  C062C-K-G  
C617C103ZCG5T PDF

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