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Manufacturer Part no Description View
ITT
ITT Cannon
MDM-25PBSM17-L56A172 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-25PBSM17-L56A172 PDF
ITT
ITT Cannon
MDM-9SBRM7-L56A141 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-9SBRM7-L56A141 PDF
ITT
ITT Cannon
MDM-21PCBRP-L56A141 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-21PCBRP-L56A141 PDF
Spansion
Spansion Inc.
S29GL016A10TAIR22 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory featuring 200 nm MirrorBit Process Technology

General Description
The S29GL-A family of devices are 3.0-Volt single-power Flash memory manufactured using 200 nm MirrorBit technology. The S29GL064A is a 64-Mb deviceorganized as 4,194,304 words or 8,388,608 bytes.

Distinctive Characteristics
Architectural Advantages
„Single power supply operation
– 3-Volt read, erase, and program operations
„Manufactured on 200 nm MirrorBit process technology
„Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number, accessible through a command sequence
– May be programmed and locked at the factory or by the customer „Flexible sector architecture
– 64Mb (uniform sector models): 128 32 Kword (64 KB) sectors
– 64 Mb (boot sector models): 127 32 Kword (64 KB) sectors
   + 8 4Kword (8KB) boot sectors
– 32 Mb (uniform sector models): 64 32Kword (64 KB) sectors
– 32 Mb (boot sector models): 63 32Kword (64 KB) sectors
  + 8 4Kword (8KB) boot sectors
– 16 Mb (boot sector models): 31 31Kword (64 KB) sectors
  + 8 4Kword (8 KB) boot sectors
„Compatibility with JEDEC standards
– Provides pinout and software compatibility for single-power supply flash, and superior inadvertent write protection „
100,000 erase cycles typical per sector
„20-year data retention typical

Performance Characteristics
„High performance
– 90 ns access time
– 4-word/8-byte page read buffer
– 25 ns page read times
– 16-word/32-byte write buffer which reduces overall programming time for multiple-word updates
„Low power consumption (typical values at 3.0 V, 5 MHz)
  – 18 mA typical active read current
  – 50 mA typical erase/program current
  – 1 µA typical standby mode current
„Package options
  – 48-pin TSOP
  – 56-pin TSOP
  – 64-ball Fortified BGA
  – 48-ball fine-pitch BGA
  – 56-ball fine pitch BGA (MCP-compatible for cellular handsets)


other parts : S29GL-A  S29GL016A  S29GL016A10BAI010  S29GL016A10BAI012  S29GL016A10BAI013  S29GL016A10BAI020  S29GL016A10BAI022  S29GL016A10BAI023  S29GL016A10BAIR10  S29GL016A10BAIR12  
S29GL016A10TAIR22 PDF
Secos
Secos Corporation.
HZ6A1 VOLTAGE 1.6 ~ 38 V, 500 mW Silicon Planar Zener Diode for Stabilized Power Supply

FEATURES
 Low leakage, low zener impedance and maximum power dissipation of 500 mW are ideally suited for stabilized power supply, etc.
 Wide spectrum from 1.6 V through 38 V of zener voltage provides flexible application.


other parts : HZ11  HZ11A1  HZ11A2  HZ11A3  HZ11B1  HZ11B2  HZ11B3  HZ11C1  HZ11C2  HZ11C3  
HZ6A1 PDF
ITT
ITT Cannon
MDM-25SBS-L56A174 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-25SBS-L56A174 PDF
AVX
AVX Corporation
02016A1R0FA77A C0G (NP0) Dielectric General Specifications

C0G (NP0) is the most popular formulation of the “temperature-compensating,” EIA Class I ceramic materials. Modern C0G (NP0) formulations contain neodymium, samarium and other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor dielectrics available. Capacitance change with temperature is 0 ±30ppm/°C which is less than ±0.3% C from -55°C to +125°C. Capacitance drift or hysteresis for C0G (NP0) ceramics is negligible at less than ±0.05% versus up to ±2% for films. Typical capacitance change with life is less than ±0.1% for C0G (NP0), one-fifth that shown by most other dielectrics. C0G (NP0) formulations show no aging characteristics.


other parts : 02016A1R0BAT2A  02016A1R0BAT4A  02016A1R0BAT7A  02016A1R0BAT9A  02016A1R0BA72A  02016A1R0BA74A  02016A1R0BA77A  02016A1R0BA79A  02016A1R0BAQ2A  02016A1R0BAQ4A  
02016A1R0FA77A PDF
ITT
ITT Cannon
MDM-51SBRM17-L56A172 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-51SBRM17-L56A172 PDF
ITT
ITT Cannon
MDM-15SCBRM17-L56A172 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-15SCBRM17-L56A172 PDF
ITT
ITT Cannon
MDM-51PBSM7-L56A141 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-51PBSM7-L56A141 PDF
ITT
ITT Cannon
MDM-15PBRP-L56A141 Micro-D PCB - .050" Contact Spacing

MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board, board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell sizes with 9 to 100 contacts. Terminations may be straight (BS) or at 90˚ right angle (BR, CBR) board thickness. Jackpost mounting for use with locking hardware is also available.


other parts : MDM-100PBR  MDM-100PBR-  MDM-25S  MDM-100PBR-A141  MDM-100PBR-A172  MDM-100PBR-A174  MDM-100PBR-A30  MDM-100PBR-L39  MDM-100PBR-L39A141  MDM-100PBR-L39A172  
MDM-15PBRP-L56A141 PDF
Spansion
Spansion Inc.
S29GL016A10BFIR10 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory featuring 200 nm MirrorBit Process Technology

General Description
The S29GL-A family of devices are 3.0-Volt single-power Flash memory manufactured using 200 nm MirrorBit technology. The S29GL064A is a 64-Mb deviceorganized as 4,194,304 words or 8,388,608 bytes.

Distinctive Characteristics
Architectural Advantages
„Single power supply operation
– 3-Volt read, erase, and program operations
„Manufactured on 200 nm MirrorBit process technology
„Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number, accessible through a command sequence
– May be programmed and locked at the factory or by the customer „Flexible sector architecture
– 64Mb (uniform sector models): 128 32 Kword (64 KB) sectors
– 64 Mb (boot sector models): 127 32 Kword (64 KB) sectors
   + 8 4Kword (8KB) boot sectors
– 32 Mb (uniform sector models): 64 32Kword (64 KB) sectors
– 32 Mb (boot sector models): 63 32Kword (64 KB) sectors
  + 8 4Kword (8KB) boot sectors
– 16 Mb (boot sector models): 31 31Kword (64 KB) sectors
  + 8 4Kword (8 KB) boot sectors
„Compatibility with JEDEC standards
– Provides pinout and software compatibility for single-power supply flash, and superior inadvertent write protection „
100,000 erase cycles typical per sector
„20-year data retention typical

Performance Characteristics
„High performance
– 90 ns access time
– 4-word/8-byte page read buffer
– 25 ns page read times
– 16-word/32-byte write buffer which reduces overall programming time for multiple-word updates
„Low power consumption (typical values at 3.0 V, 5 MHz)
  – 18 mA typical active read current
  – 50 mA typical erase/program current
  – 1 µA typical standby mode current
„Package options
  – 48-pin TSOP
  – 56-pin TSOP
  – 64-ball Fortified BGA
  – 48-ball fine-pitch BGA
  – 56-ball fine pitch BGA (MCP-compatible for cellular handsets)


other parts : S29GL-A  S29GL016A  S29GL016A10BAI010  S29GL016A10BAI012  S29GL016A10BAI013  S29GL016A10BAI020  S29GL016A10BAI022  S29GL016A10BAI023  S29GL016A10BAIR10  S29GL016A10BAIR12  
S29GL016A10BFIR10 PDF

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