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BY228

  

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Manufacturer Part no Description View
Philips
Philips Electronics
BY228 Damper Diodes / SOD64 Package.

Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

BY228 PDF
ETC
Unspecified
BY228 Fast recovery diode

GBY228 5A 1500V plastic packaging

 

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BY228 PDF
GULFSEMI
Gulf Semiconductor
BY228 Clamper/Damper Glass Passivated Rectifier

GBY228 5A 1500V plastic packaging

 

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BY228 PDF
FRONTIER
Frontier Electronics.
BY228 Damper Diodes

GBY228 5A 1500V plastic packaging

 

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BY228 PDF
LUGUANG
Shenzhen Luguang Electronic Technology Co., Ltd
BY228 Damper Diodes

GBY228 5A 1500V plastic packaging

 

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BY228 PDF
GE
General Semiconductor
BY228 Damper Diodes

GBY228 5A 1500V plastic packaging

 

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BY228 PDF
DACHANG
Rugao Dachang Electronics Co., Ltd
BY228 Damper Diodes

GBY228 5A 1500V plastic packaging

 

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BY228 PDF
General
General Semiconductor
BY228 Clamper / Damper Glass Passivated Rectifier

GBY228 5A 1500V plastic packaging

 

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BY228 PDF
Semikron
Semikron
BY228G Standard silicon rectifier diodes

Standard silicon rectifier diodes
Forward Current: 3 A
Reverse Voltage: 450 to 1500 V


other parts : BY226G  BY227G  
BY228G PDF
Semikron
Semikron
BY228S Standard silicon rectifier diodes

Standard silicon rectifier diodes
Forward Current: 1,5 A
Reverse Voltage: 450 to 1500 V

 

 

 


other parts : BY226S  BY227S  
BY228S PDF
SUNMATE
SUNMATE electronic Co., LTD
BY228GP 3.0A Axial Leaded Sintered Class Junction Plastic Rectifier

Features
● High temperature metallurgically bonded construction
● Sintered glass cavity free junction
● Capability of meeting environmental standard of MIL-S-19500
● High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension
● Operate at Ta =55°C with no thermal run away
● Typical Ir<0.1µA

BY228GP PDF
Vishay
Vishay Semiconductors
BY228GP Clamper/Damper Glass Passivated Rectifier

FEATURES
• Superectifier structure for high reliability application
• Cavity-free glass-passivated junction
• Low forward voltage drop
• Typical IR less than 0.1 μA
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• AEC-Q101 qualified
• Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS
  For use in high voltage


other parts : BY228GP-E3/54  BY228GP-E3/73  BY228GPHE3/54  BY228GPHE3/73  
BY228GP PDF

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