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W25Q64DWSFIG Datasheet PDF - Winbond

Part NameDescriptionManufacturer
W25Q64DWSFIG 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Winbond
Winbond Winbond
W25Q64DWSFIG Datasheet PDF : W25Q64DWSFIG pdf   
W25Q64DW image

1.  GENERAL DESCRIPTION
The W25Q64DW (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.7V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space saving packages.
The W25Q64DW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64DW has 2,048 erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.)

2.  FEATURES
• Family of SpiFlash Memories
– W25Q64DW: 64M-bit / 8M-byte (8,388,608)
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3

• Highest Performance Serial Flash
– 104MHz Standard/Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention

• Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash

• Low Power, Wide Temperature Range
– Single 1.7 to 1.95V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range

• Flexible Architecture with 4KB sectors
– Uniform Sector Erase (4K-bytes)
– Uniform Block Erase (32K and 64K-bytes)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume

• Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– 4X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits

• Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– Contact Winbond for KGD and other options

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