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W25Q64CVSSI Datasheet PDF - Winbond

Part NumberW25Q64CVSSI Winbond
Winbond Winbond
Description3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVSSI Datasheet PDF : W25Q64CVSSI pdf   
W25Q64CV image

GENERAL DESCRIPTION
The  W25Q64CV  (64M-bit)  Serial  Flash  memory  provides  a  storage  solution  for  systems  with  limited space,  pins  and  power.  The  25Q  series  offers  flexibility  and  performance  well  beyond  ordinary  Serial Flash devices. They are ideal for  code  shadowing to RAM,  executing code  directly from Dual/Quad SPI (XIP)  and  storing voice, text and data. The device operates  on a single  2.7V to  3.6V power supply with current consumption as low as 4mA active and 1µA for power-down.

FEATURES
Family of SpiFlash Memories
– W25Q64CV: 64M-bit / 8M-byte (8,388,608)
– 256-byte per programmable page
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

Highest Performance Serial Flash
– 80MHz Dual/Quad SPI clocks
– 160/320MHz equivalent Dual/Quad SPI
– 40MB/S continuous data transfer rate
– Up to 8X that of ordinary Serial Flash
– More than 100,000 erase/program cycles(1)
– More than 20-year data retention

Efficient “Continuous Read Mode”
– Low Instruction overhead
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash

Efficient “Continuous Read Mode”
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40° C to +85°C operating range

Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4/32/64K-bytes)
– Program one to 256 bytes
– Erase/Program Suspend & Resume

Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Byte Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits

Space Efficient Packaging(1)
– 8-pin SOIC/VSOP 208-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– Contact Winbond for KGD and other options

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