3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
The mPC2745TB and mPC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.
The mPC2745TB and mPC2746TB have each compatible pin connections and performance to mPC2745T/mPC2746T of conventional minimold version. So, in the case of reducing your system size, mPC2745TB/mPC2746TB are suitable to replace from mPC2745T/mPC2746T.
These ICs are manufactured using NEC’s 20 GHz fT NESATäIII silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
• High-density surface mounting :
6 pin super minimold package
• Supply voltage :
Recommended VCC = 2.7 to 3.3 V
Circuit operation VCC = 1.8 to 3.3 V
• Wideband response :
fu = 2.7 GHzTYP. @mPC2745TB
fu = 1.5 GHzTYP. @mPC2746TB
• High isolation :
ISL = 38 dBTYP. @mPC2745TB
ISL = 45 dBTYP. @mPC2746TB
• 1.5 GHz to 2.5 GHz communication system
(PHS, wireless LAN; etc.): mPC2745TB
• 800 MHz to 900 MHz cellular telephone
(CT2, GSM, etc.) : mPC2746TB