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IRF1407SPBF Datasheet PDF - International Rectifier

Part Name
Description
Manufacturer
IRF1407SPBF
IR
International Rectifier IR
Other PDF
  no available.
PDF
IRF1407SPBF Datasheet PDF : IRF1407SPBF pdf     
IRF1407SPBF image

Description
Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRF1407L) is available for low profile applications.

Benefits
O Advanced Process Technology
O Ultra Low On-Resistance
O Dynamic dv/dt Rating
O 175°C Operating Temperature
O Fast Switching
O Repetitive Avalanche Allowed up to Tjmax
O Lead-Free

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Part Name
Description
PDF
Manufacturer
HEXFET® Power MOSFET
Unspecified
HEXFET®Power MOSFET
Unspecified
HEXFET Power MOSFET
Unspecified
HEXFET® Power MOSFET
Unspecified
HEXFET® Power MOSFET
Unspecified
HEXFET® Power MOSFET
Unspecified
HEXFET® Power MOSFET
Unspecified
HEXFET® Power MOSFET
Unspecified
HEXFET® Power MOSFET
Kersemi Electronic Co., Ltd.
HEXFET® Power MOSFET
Unspecified

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