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2N2857 Datasheet PDF - Central Semiconductor

Part Number2N2857 Central-Semiconductor
Central Semiconductor Central-Semiconductor
DescriptionSmall Signal Transistor
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2N2857 Datasheet PDF : 2N2857 pdf   
2N2857 image

Small Signal Transistor
NPN - RF Transistor Chip

PROCESS DETAILS

  Process                                EPITAXIAL PLANAR
  Die Size                               14.5 x 14.5 MILS
  Die Thickness                       7.1 MILS
  Base Bonding Pad Area         2.4 x 2.2 MILS
  Emitter Bonding Pad Area      2.4 x 2.2 MILS
  Top Side Metalization            Al - 30,000Å
  Back Side Metalization           Au - 18,000Å

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