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DESCRIPTION
The QVB series of SWITCHes is designed to allow the user maximum flexibility in applications. Each SWITCH consists of an infrared emitting diode facing an NPN phototransistor across a .125" (3.18 mm) gap.

DESCRIPTION
The QVA series of SWITCHes is designed to allow the user maximum flexibility in applications. Each SWITCH consists of an infrared emitting diode facing an NPN phototransistor across a .125" (3.18 mm) gap.

Description

The OPB816 consists of an infrared emitting diode and an NPN silicon phototransistor mounted in an opaque housing with clear windows for dust protection. The deep slot allows for a longer reach of the OPTICAL center line from the mounting plane, .650” (16.51 mm).

Features

·.20”(5.08 mm) wide gap

·24”minimum, 26 AWG wire leads .86” (21.8 mm) deep slot

·Dust protection

Description:
The OPB817Z SLOTTED SWITCH consists of an infrared emitting diode and a NPN silicon phototransistor mounted in an opaque housing with clear windows for dust protection. SWITCHing of the phototransistor occurs whenever an opaque object passes through the slot.

Features:
• 0.20” (5.08 mm) wide gap, 0.86” (21.84 mm) deep slot
• 24” (609 mm) 26 AWG wires
• Dust protection
• Two mounting tabs

Applications:
• Non-contact object sensing
• Assembly line automation
• Machine automation
• Equipment security
• Machine safety

Description:
The OPB817Z SLOTTED SWITCH consists of an infrared emitting diode and a NPN silicon phototransistor mounted in an opaque housing with clear windows for dust protection. SWITCHing of the phototransistor occurs whenever an opaque object passes through the slot.

Features:
● 0.20” (5.08 mm) wide gap, 0.86” (21.84 mm) deep slot
● 24” (609 mm) 26 AWG wires
● Dust protection
● Two mounting tabs

Applications:
● Non-contact object sensing
● Assembly line automation
● Machine automation
● Equipment security
● Machine safety

DESCRIPTION
The OPB866T series of SWITCHes is designed to allow the user maximum flexibility in applications. Each SWITCH consists of an infrared emitting diode facing an NPN phototransistor across a .125" (3.18 mm) gap. A unique housing design provides a smooth external surface to prevent dust built-up while molded itnernal apertures give precise positioning and also provide protection from ambient light interference.

FEATURES
■ Fully enclosed design allow dust and ambient light protection.
■ Lead spacing at .220".
■ .050" and .010" aperture options.
■ PCB mountable.

Description
The OPB818 consists of an infrared emitting diode and an NPN silicon phototransistor mounted in a low cost black plastic housing on opposite sides of a 0.200” (5.080 mm) wide slot. Phototransistor SWITCHing takes place whenever an opague object passes through the slot. The OPB818 is designed for direct soldering into PC Boards or mounting in standard dual-in-line sockets.

Features
● Non-contact SWITCHing
● For direct PC board or dual-in-line socket mounting
● 0.400” (10.16 mm) lead spacing
● 0.200” (5.08 mm) wide slot

DESCRIPTION
The OPB867T series of SWITCHes is designed to allow the user maximum flexibility in applications. Each SWITCH consists of an infrared emitting diode facing an NPN phototransistor across a .125" (3.18 mm) gap. A unique housing design provides a smooth external surface to prevent dust built-up while molded itnernal apertures give precise positioning and also provide protection from ambient light interference.

FEATURES
■ Fully enclosed design allow dust and ambient light protection.
■ Lead spacing at .220".
■ .050" and .010" aperture options.
■ PCB mountable.