Special Features • Intermediate Bus Converter for Front End (DPA) Distributed Power Architecture application • High efficiency (95% Typical) • Industry standard package 16th Brick 0.90” x 1.30” • High capacitive load limit on start-up • Output Enable Pin • Undervoltage lockout • Over Temperature Protection • Meets Basic Insulation • EU directive 2002/95/EC compliant for RoHS
Introduction This reference Manual is addressed to application developers. It provides complete information on how to use the STM32F101xx, STM32F102xx, STM32F103xx and STM32F105xx/STM32F107xx microcontroller memory and peripherals. The STM32F101xx, STM32F102xx, STM32F103xx and STM32F105xx/STM32F107xx will be referred to as STM32F10xxx throughout the document, unless otherwise specified. The STM32F10xxx is a family of microcontrollers with different memory sizes, packages and peripherals. For ordering information, mechanical and electrical device characteristics refer to the low-, medium-, high- and XL-density STM32F101xx and STM32F103xx datasheets, to the low and medium-density STM32F102xx datasheets and to the STM32F105xx/STM32F107xx connectivity line datasheet. For information on programming, erasing and protection of the internal Flash memory refer to:
• PM0075, the Flash programming Manual for low-, medium- high-density and connectivity line STM32F10xxx devices • PM0068, the Flash programming Manual for XL-density STM32F10xxx devices. For information on the Arm® Cortex®-M3 core, refer to the STM32F10xxx Cortex®-M3 programming Manual (PM0056).
INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 8−lead SOIC package. These evaluation boards are offered as a convenience for the customers interested in performing their own engineering assessment on the general performance of the 8−lead SOIC device samples. The board provides a high bandwidth 50 controlled impedance environment. The pictures in Figure 1 show the top and bottom view of the evaluation board, which can be configured in several different ways, depending on device under test (See Table 1. Configuration List).
This evaluation board Manual contains: • Information on 8−lead SOIC Evaluation Board • Assembly Instructions • Appropriate Lab Setup • Bill of Materials
This Manual should be used in conjunction with the device data sheet, which contains full technical details on the device specifications and operation.
This Manual includes hardware details and programming information for the MC68HC000, the MC68HC001, the MC68EC000, and the MC68SEC000. For ease of reading, the name M68000 MPUs will be used when referring to all processors. Refer to M68000PM/AD, M68000 Programmer's Reference Manual, for detailed information on the MC68000 instruction set.
The four microprocessors are very similar to each other and all contain the following features:
• Sixteen 32-Bit Data and Address Registers
• 16-Mbyte Direct Addressing Range
• Program Counter
• 6 Instruction Types
• Operations on Five Main Data Types
• Memory-Mapped Input/Output (I/O)
• 14 Addressing Modes
The following processors contain additional features:
— Statically selectable 8- or 16-bit data bus
— Low power
This Manual includes hardware details and programming information for the MC68000, the MC68HC000, the MC68HC001, the MC68008, the MC68010, and the MC68EC000. For ease of reading, the name M68000 MPUs will be used when referring to all processors. Refer to M68000PM/AD, M68000 Programmers Reference Manual, for detailed information on the MC68000 instruction set. The six microprocessors are very similar. They all contain the following
features • 16 32-Bit Data and Address Registers • 16-Mbyte Direct Addressing Range • Program Counter • 6 Powerful Instruction Types • Operations on Five Main Data Types • Memory-Mapped Input/Output (I/O) • 14 Addressing Modes The following processors contain additional features: • MC68010 —Virtual Memory/Machine Support —High-Performance Looping Instructions • MC68HC001/MC68EC000 —Statically Selectable 8- or 16-Bit Data Bus • MC68HC000/MC68EC000/MC68HC001 —Low-Power