datasheetbank_Logo     Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

P/N + Description + Content Search

Search Words :

Part Name(s) : IRF830S IR
International Rectifier
Description : DESCRIPTION View

DESCRIPTION
Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

• Surface Mount
AVAILABLE in Tape & Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements

Part Name(s) : 2SA1694 A1694 Iscsemi
Inchange Semiconductor
Description : DESCRIPTION View

DESCRIPTION
·High Collector-Emitter Breakdown Voltage V(BR)CEO= -120V(Min)
·Good Linearity of hFE
·Complement to Type 2SC4467

APPLICATIONS
·Designed for audio and general purpose applications

Part Name(s) : INN180 TDA955 ETC
Unspecified
Description : EXAMINATION in Hradware DESCRIPTION and Verification View

EXAMINATION in Hradware DESCRIPTION and Verification

Part Name(s) : AON7538 AON7538L ETC
Unspecified
Description : DFN3X3 PACKAGE MARKING DESCRIPTION View

[Alpha & Omega Semiconductor, Ltd.]

DFN3X3 PACKAGE MARKING DESCRIPTION


Part Name(s) : AO3410 AO3410L AOSMD
Alpha and Omega Semiconductor
Description : PACKAGE MARKING DESCRIPTION View

PACKAGE MARKING DESCRIPTION

Part Name(s) : AON7414 AON7414L ETC
Unspecified
Description : DFN 3X3 PACKAGE MARKING DESCRIPTION View

[Alpha & Omega Semiconductor, Ltd.]

DFN 3X3 PACKAGE MARKING DESCRIPTION

Part Name(s) : M14C16DD M14C16_DD ST-Microelectronics
STMicroelectronics
Description : M14C16 Die DESCRIPTION View

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm).

PRODUCT M14C16
■ WAFER SIZE 152 mm (6 inches)
■ DIE IDENTIFICATION M14C16KA_R
■ DIE SIZE (X x Y) 1390 x 2375 µm
■ SCRIBE LINE 101.8 x 102.4 µm
■ PAD OPENING 100 x 100 µm

DIE LAYOUT
■ DI Die Identification (at the position shown in Figure 1)
■ C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
■ C4, C6, C8 These ISO pins do NOt appear on the M14C16 die
■ NC This pad, shown in Figure 1, is NOt Connected

Part Name(s) : AO4578L AO4578 AOSMD
Alpha and Omega Semiconductor
Description : SO8 PACKAGE MARKING DESCRIPTION View

SO8 PACKAGE MARKING DESCRIPTION

Part Name(s) : AOD474B AOD474BL AOSMD
Alpha and Omega Semiconductor
Description : DPAK (TO-251) PACKAGE MARKING DESCRIPTION View

DPAK (TO-251) PACKAGE MARKING DESCRIPTION

1

2

All Rights Reserved © datasheetbank.com 2014 - 2020 [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]