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Part Name(s) : 3N253
New Jersey Semiconductor
New Jersey Semiconductor
Description : MINIATURE INTEGRAL DIODE ASSEMBLIES

MINIATURE INTEGRAL DIODE ASSEMBLIES

... with silicon rectifier chips interconnected and encapsulated into voidless rectifier bridge circuits.

● High Resistance to Shock and Vibration
● High Dielectric Strength
● Built-In Printed Circuit Board Stand•Offs
● UL Recognized
● ROJA = 60°C/W

Part Name(s) : 3N247
New Jersey Semiconductor
New Jersey Semiconductor
Description : MINIATURE INTEGRAL DIODE ASSEMBLIES

MINIATURE INTEGRAL DIODE ASSEMBLIES

... with silicon rectifier chips interconnected and encapsulated into voidless rectifier bridge circuits.

● High Resistance to Shock and Vibration
● High Dielectric Strength
● Built-In Printed Circuit Board Stand•Offs
● UL Recognized
● ROJA = 60°C/W

Part Name(s) : 3N246
New Jersey Semiconductor
New Jersey Semiconductor
Description : MINIATURE INTEGRAL DIODE ASSEMBLIES (Rev - V2)

MINIATURE INTEGRAL DIODE ASSEMBLIES

... with silicon rectifier chips interconnected and encapsulated into voidless rectifier bridge circuits.

● High Resistance to Shock and Vibration
● High Dielectric Strength
● Built-In Printed Circuit Board Stand•Offs
● UL Recognized
● ROJA = 60°C/W

Part Name(s) : APE1C2150
Unspecified
Unspecified
Description : Body/contact ASSEMBLIES - Screw clamp terminal connections

[Telemecanique]

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES - Screw clamp terminal connections

Control and signalling units Ø 22
Harmony® XB4, metal
Light blocks - “Test light” - Protection

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES - Spring terminal connections

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES for printed circuit board

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES - Faston connectors

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES - Plug-in connector

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES + light blocks with INTEGRAL LED

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES + light blocks with INTEGRAL LED

Control and signalling units Ø 22
Harmony® XB4, metal
Body/light ASSEMBLIES for pilot lights with INTEGRAL LED

Control and signalling units Ø 22
Harmony® XB4, metal
Body/light ASSEMBLIES for pilot lights with INTEGRAL LED

Control and signalling units Ø 22
Harmony® XB4, metal
Body/contact ASSEMBLIES + light blocks with BA 9s base fitting

Control and signalling units Ø 22
Harmony® XB4, metal
Light bodies for pilot lights with BA 9s base fitting

Part Name(s) : 697
Microsemi Corporation
Microsemi Corporation
Description : RECTIFIERS ASSEMBLIES Single Phase Bridges, 7.5 Amp, Standard And Fast Recovery

DESCRIPTION
The MINIATURE molded high-current single-phase bridges are designed for universal application in power supplies.

FEATURES
MINIATURE High Current ASSEMBLIES
● Continuous Ratings: to 7.5A
● Surge Ratings: to 80A
● PIVs: from 100V to 600V
● Recovery Times: to 500ns
● Only Fused-in-Glass Dioes Used
● Controlled Avalanche Characteristics

Part Name(s) : OP251
Optek Technology
Optek Technology
Description : Infrared Light Emitting DIODE in MINIATURE SMD Package

Infrared Light Emitting DIODE in MINIATURE SMD Package

The OP251 is a GaAlAs infrared LEDs mounted in a MINIATURE SMT package. The device incorporates an INTEGRAL molded lens which enables a tight beam angle and provides an even emission pattern. This device is packaged in a 1206 size chip carrier that is compatible with most automated mounting equipment. The OP251 is mechanically and spectrally matched to the OP520 series phototransistors.

OP251
• Internal Lens
• High Power
• 1206 Package Size
• 880nm Wavelength

Applications
• Non-Contact Position Sensing
• Datum detection
• Machine automation
• Optical encoders

Part Name(s) : OP251
TT Electronics.
TT Electronics.
Description : Infrared Light Emitting DIODE in MINIATURE SMD Package

Infrared Light Emitting DIODE in MINIATURE SMD Package

The OP251 is a GaAlAs infrared LEDs mounted in a MINIATURE SMT package. The device incorporates an INTEGRAL molded lens which enables a tight beam angle and provides an even emission pattern. This device is packaged in a 1206 size chip carrier that is compatible with most automated mounting equipment. The OP251 is mechanically and spectrally matched to the OP520 series phototransistors.

OP251
• Internal Lens
• High Power
• 1206 Package Size
• 880nm Wavelength

Applications
• Non-Contact Position Sensing
• Datum detection
• Machine automation
• Optical encoders

Part Name(s) : PACDN016S
California Micro Devices Corp
California Micro Devices Corp
Description : 6 CHANNEL ESD PROTECTION ARRAY WITH ZENER SUPPLY CLAMP

Product Description
The PAC™ DN016 is a DIODE array designed to provide 6 channels of ESD protection for electronic components or subsystems. Each channel consists of a pair of DIODEs which steers the ESD current pulse either to the positive (VP) or negative (VN) supply. In addition, there is an INTEGRAL Zener DIODE between VP and VN to suppress any voltage disturbance due to these ESD current pulses. The PAC DN016 will protect against ESD pulses up to 15KV Human Body Model, and 8KV contact discharge per International Standard IEC 61000-4-2.

Features
• Six channels of ESD protection
INTEGRAL Zener DIODE clamp to suppress supply rail transient
• 15KV ESD protection (HBM)
• 8KV contact, 15KV air ESD protection per IEC 61000-4-2
• Low loading capacitance, 3pF typ
MINIATURE 8-pin MSOP or SOIC package

Applications
• I/O port protection for cellular phones, notebook computers, PDAs, etc.
• ESD protection for VGA (Video) port in PC’s or Notebook computers.
• ESD protection for sensitive electronic equipment.

Part Name(s) : BY614
New Jersey Semiconductor
New Jersey Semiconductor
Description : MINIATURE high-voltage soft-recovery rectifier

DESCRIPTION
MINIATURE glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.

FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Soft-recovery switching characteristics
• Very compact construction.

APPLICATIONS
MINIATURE high-voltage ASSEMBLIES such as voltage multipliers.

Part Name(s) : BY614
Philips Electronics
Philips Electronics
Description : MINIATURE high-voltage soft-recovery rectifier

DESCRIPTION
MINIATURE glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.

FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Soft-recovery switching characteristics
• Very compact construction.

APPLICATIONS
MINIATURE high-voltage ASSEMBLIES such as voltage multipliers.

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