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Part Name(s) : NOIL2SC1300A-GDC NOIL2SC1300A-GWC NOIL2SM1300A NOIL2SM1300A-GDC NOIL2SM1300A-GWC NOIL2SM1300A NOIL2SC1300A-GDC NOIL2SC1300A-GWC NOIL2SM1300A-GDC NOIL2SM1300A-GWC ON-Semiconductor
ON Semiconductor
Description : LUPA1300-2: HIGH SPEED CMOS IMAGE SENSOR View

Description
The LUPA1300-2 is an integrated SXGA HIGH SPEED, HIGH sensitivity CMOS IMAGE SENSOR. This SENSOR targets HIGH SPEED machine vision and industrial monitoring applications. The LUPA1300-2 SENSOR runs at 500 fps and has triggered and pipelined shutter modes. It packs 24 parallel 10-bit A/D converters with an aggregate conversion rate of 740 MSPS. On-chip digital column FPN correction enables the SENSOR to output ready to use IMAGE data for most applications. To enable simple and reliable system integration, the 12 channels, 1 sync channel, 8 Gbps, and LVDS serial link protocol supports skew correction and serial link integrity monitoring.

Features
• 1280 x 1024 Active Pixels
• 14 μm X 14 μm Square Pixels
• 1.4” Optical Format
• Monochrome or Color Digital Output
• 500 fps Frame Rate
• On-Chip 10-Bit ADCs
• 12 LVDS Serial Outputs
• Random Programmable ROI Readout
• Pipelined and Triggered Global Shutter
• On-Chip Column FPN Correction
• Serial Peripheral Interface (SPI)
• Limited Supplies: Nominal 2.5 V and 3.3 V
• −50°C to +85°C Operational Temperature Range
• 168-Pin μPGA Package
• Power Dissipation: 1350 mW
• These Devices are Pb−Free and are RoHS Compliant

Applications
HIGH SPEED Machine Vision
• Motion Analysis
• Medical Imaging
• Intelligent Traffic System
• Industrial Imaging

Part Name(s) : H1A424M167 Hynix
Hynix Semiconductor
Description : IMAGE Signal Processor for Hyundai CMOS IMAGE SENSOR View

Features
■ Dedicated SENSOR control and signal processing chip
   for Hyundai CMOS IMAGE SENSOR
CMOS 3.3V Device (0.5um CMOS TLM Process used)
■ Serial-Bus interface or alternative 8-bit MCU parallel interface
   for register programming
■ Serial-Bus interface for HYUNDAI CMOS IMAGE SENSOR Chip Control
■ 8 bit Bayer format IMAGE input
■ 3 x 3 Interpolation
■ Color Correction matrix
■ Gamma Correction
■ Automatic Exposure Control
■ Automatic White Balance Control
■ Programmable AE/AWB windows
■ Automatic Reset Level Control
■ Edge Enhancement Support
■ 2x2, 4x4 Sub-Sampling(CIF, QCIF)
■ RGB to YCrCb Color Space Convert
■ Histogram Equalization Logic
■ 16bit YUV 4:2:2, YUV 4:2:0, 8bit YUV 4:2:2, YUV 4:2:0 video output format
■ Flicker Free Banding noise filter
■ X Flip Function for mirrored IMAGE
■ Horizontal and Vertical Sync Information on Separate Pin
■ 64 Pin LQFP Package(Standard JEDEC Package)

Part Name(s) : H1A424M167 Hyundai
Hyundai Micro Electronics
Description : IMAGE Signal Processor for Hyundai CMOS IMAGE SENSOR View

Features
■ Dedicated SENSOR control and signal processing chip
   for Hyundai CMOS IMAGE SENSOR
CMOS 3.3V Device (0.5um CMOS TLM Process used)
■ Serial-Bus interface or alternative 8-bit MCU parallel interface
   for register programming
■ Serial-Bus interface for HYUNDAI CMOS IMAGE SENSOR Chip Control
■ 8 bit Bayer format IMAGE input
■ 3 x 3 Interpolation
■ Color Correction matrix
■ Gamma Correction
■ Automatic Exposure Control
■ Automatic White Balance Control
■ Programmable AE/AWB windows
■ Automatic Reset Level Control
■ Edge Enhancement Support
■ 2x2, 4x4 Sub-Sampling(CIF, QCIF)
■ RGB to YCrCb Color Space Convert
■ Histogram Equalization Logic
■ 16bit YUV 4:2:2, YUV 4:2:0, 8bit YUV 4:2:2, YUV 4:2:0 video output format
■ Flicker Free Banding noise filter
■ X Flip Function for mirrored IMAGE
■ Horizontal and Vertical Sync Information on Separate Pin
■ 64 Pin LQFP Package(Standard JEDEC Package)

Part Name(s) : IA1208-FE10A ROHM
ROHM Semiconductor
Description : Color IMAGE SENSOR heads for HIGH-SPEED Scanner View

Contact IMAGE SENSOR Head with 3 times HIGHer scanning SPEED due to 3ch outputs. Newly developed resolution change-over IC is employed which has improved noise resistance.

Features
1) HIGH SPEED reading capability due to 3 analog output.
2) Signal amplifier is built into the IMAGE SENSOR IC in order to increase immunity to external noise.
3) ROHM’s newly developed SENSOR IC reduces failures due to ESD (based on the IEC61000-4-2 standard).
4) With the proprietary prism, the output signal is maintained uniformly.
5) The ceramic substrate is used for excellent dimensional accuracy and thermal stability.

Applications
 HIGH SPEED reading equipment (i.e. document scanners, plotters, laser multifunction devices).

 


Part Name(s) : HV7131E1 Hynix
Hynix Semiconductor
Description : CMOS IMAGE SENSOR With 8-bit ADC View

CMOS IMAGE SENSOR With 8-bit ADC

Part Name(s) : HB7131D Hynix
Hynix Semiconductor
Description : CMOS IMAGE SENSOR With 8-bit ADC View

CMOS IMAGE SENSOR With 8-bit ADC

Part Name(s) : HB7141D Hynix
Hynix Semiconductor
Description : CMOS IMAGE SENSOR With 8-bit ADC View

CMOS IMAGE SENSOR With 8-bit ADC

Part Name(s) : HV7141D Hynix
Hynix Semiconductor
Description : CMOS IMAGE SENSOR With 8-bit ADC View

CMOS IMAGE SENSOR With 8-bit ADC

Part Name(s) : HV7121B-COF Hynix
Hynix Semiconductor
Description : CMOS IMAGE SENSOR With 8-bit ADC View

CMOS IMAGE SENSOR With 8-bit ADC

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