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Part Name(s) : V436516S04VATG-75 V436516S04VTG-75 Mosel-Vitelic
Mosel Vitelic Corporation
Description : 3.3 VOLT 16M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE View

Description
The V436516S04VATG-75 memory MODULE is organized 16,777,216 x 64 bits in a 168 pin dual in line memory MODULE (DIMM). The 16M x 64 memory MODULE uses 8 Mosel-Vitelic 16M x 8 SDRAM. The x64 MODULEs are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 168 Pin UNBUFFERED 16,777,216 x 64 bit Oganization SDRAM DIMM
■ Utilizes High Performance 128 Mbit, 16M x 8 SDRAM in TSOPII-54 Packages
■ Fully PC Board Layout Compatible to INTEL’S Rev 1.0 MODULE Specification
■ Single +3.3V (± 0.3V) Power Supply
■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are LVTTL Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Present Detect (SPD)
SDRAM Performance

Part Name(s) : V436516R04VTG-75 V436516S04VATG-75PC V436516R04VATG-75PC Mosel-Vitelic
Mosel Vitelic Corporation
Description : 3.3 VOLT 16M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE View

Description
The V436516S04VATG-75PC memory MODULE is organized 16,777,216 x 64 bits in a 168 pin dual in line memory MODULE (DIMM). The 16M x 64 memory MODULE uses 8 Mosel-Vitelic 16M x 8 SDRAM. The x64 MODULEs are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 168 Pin UNBUFFERED 16,777,216 x 64 bit Oganization SDRAM DIMM
■ Utilizes High Performance 128 Mbit, 16M x 8 SDRAM in TSOPII-54 Packages
■ Fully PC Board Layout Compatible to INTEL’S Rev 1.0 MODULE Specification
■ Single +3.3V (± 0.3V) Power Supply
■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are LVTTL Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Present Detect (SPD)
SDRAM Performance

Part Name(s) : V436516R04VATG-75 Mosel-Vitelic
Mosel Vitelic Corporation
Description : 3.3 VOLT 16M x 64 (using 8M x 16) PC133 UNBUFFERED SDRAM MODULE View

Description
The V436516R04VATG-75 memory MODULE is organized 16, 777, 216 x 64 bits in a 168 pin dual in line memory MODULE (DIMM). The 16M x 64 memory MODULE uses 8 Mosel-Vitelic 8M x 16 SDRAM. The x64 MODULEs are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 168 Pin UNBUFFERED 16, 777, 216 x 64 bit Oganization SDRAM DIMM
■ Utilizes High Performance 128 Mbit, 8M x 16 SDRAM in TSOPII-54 Packages
■ Fully PC Board Layout Compatible to INTEL’S Rev 1.0 MODULE Specification
■ Single +3.3V (± 0.3V) Power Supply
■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are LVTTL Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Present Detect (SPD)
SDRAM Performance

Part Name(s) : V436516R04VATG-75 MOSEL
Mosel Vitelic, Corp
Description : 3.3 VOLT 16M x 64 (using 8M x 16) PC133 UNBUFFERED SDRAM MODULE View

Description
The V436516R04VATG-75 memory MODULE is organized 16, 777, 216 x 64 bits in a 168 pin dual in line memory MODULE (DIMM). The 16M x 64 memory MODULE uses 8 Mosel-Vitelic 8M x 16 SDRAM. The x64 MODULEs are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 168 Pin UNBUFFERED 16, 777, 216 x 64 bit Oganization SDRAM DIMM
■ Utilizes High Performance 128 Mbit, 8M x 16 SDRAM in TSOPII-54 Packages
■ Fully PC Board Layout Compatible to INTEL’S Rev 1.0 MODULE Specification
■ Single +3.3V (± 0.3V) Power Supply
■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are LVTTL Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Present Detect (SPD)
SDRAM Performance


Part Name(s) : V436416S04V V436416S04V(C)TG-10PC V436416S04VCTG-10PC V436416S04VTG-10PC Mosel-Vitelic
Mosel Vitelic Corporation
Description : 3.3 VOLT 16M x 64 HIGH PERFORMANCE PC100 UNBUFFERED SDRAM MODULE View

Description
The V436416S04V(C)TG-10PC memory MODULE is organized 16,777,216 x 64 bits in a 168 pin dual in line memory MODULE (DIMM). The 16M x 64 UNBUFFERED DIMM uses 16 Mosel-Vitelic 8M x 8 SDRAM. The x64 MODULEs are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 168 Pin UNBUFFERED 16,777,216 x 64 bit  Oganization SDRAM MODULEs
■ Utilizes High Performance 8M x 8 SDRAM in  TSOPII-54 Packages
■ Fully PC Board Layout Compatible to INTEL’S  Rev 1.0 MODULE Specification
■ Single +3.3V (± 0.3V) Power Supply
■ Programmable CAS Latency, Burst Length, and  Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are LVTTL Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Present Detect (SPD)
SDRAM Performance

Part Name(s) : V436416S04V(C)TG-75 V436416S04VCTG-75 V436416S04VTG-75 Mosel-Vitelic
Mosel Vitelic Corporation
Description : 3.3 VOLT 16M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE View

Description
The V436416S04V(C)TG-75 memory MODULE is organized 16,777,216 x 64 bits in a 168 pin dual in line memory MODULE (DIMM). The 16M x 64 memory MODULE uses 16 Mosel-Vitelic 8M x 8 SDRAM. The x64 MODULEs are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 168 Pin UNBUFFERED 16,777,216 x 64 bit Oganization SDRAM DIMMs
■ Utilizes High Performance 8M x 8 SDRAM in TSOPII-54 Packages
■ Fully PC Board Layout Compatible to INTEL’S Rev 1.0 MODULE Specification
■ Single +3.3V (± 0.3V) Power Supply
■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are LVTTL Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Present Detect (SPD)
SDRAM Performance
■ Supported Latencies at 133 MHz Operation

Part Name(s) : NT128S64V88C0G-75B NT128S64V88C0G-7K NT128S64V88C0G-8B NT128S64V88C0G Nanya
Nanya Technology
Description : 128MB : 16M x 64 UNBUFFERED SDRAM MODULE View

Description
NT128S64V88C0G-7K/75B/8B are UNBUFFERED 168-pin Synchronous DRAM Dual In-Line Memory MODULEs (DIMMs) which are organized as 16Mx64 high-speed memory arrays and are configured as one 16M x 64 physical bank. The DIMMs use eight 16Mx8 SDRAMs in 400mil TSOP II pack-ages. The DIMMs achieve high-speed data transfer rates of up to 133MHz by employing a prefetch / pipeline hybrid architecture that supports the JEDEC 1N rule while allowing very low burst power.

Features
● 168-Pin UNBUFFERED 8-Byte Dual In-Line Memory MODULE
● Intended for PC133 applications
    - Clock Frequency: 133MHz
    - Clock Cycle: 7.5ns
    - Clock Assess Time: 5.4ns
● Inputs and outputs are LVTTL (3.3V) compatible
● Single 3.3V ± 0.3V Power Supply
● Single Pulsed RAS interface
SDRAMs have 4 internal banks
MODULE has 1 physical bank
● Fully Synchronous to positive Clock Edge
● Data Mask for Byte Read/Write control
● Auto Refresh (CBR) and Self Refresh
● Automatic and controlled Precharge commands
● Programmable Operation:
    - CAS Latency: 2, 3
    - Burst Type: Sequential or Interleave
    - Burst Length: 1, 2, 4, 8
    - Operation: Burst Read and Write or Multiple Burst Read with Single Write
● Suspend Mode and Power Down Mode
● 4096 Refresh cycles distributed across 64ms
● Gold contacts
SDRAMs in TSOP Type II Package
● Serial Presence Detect with Write Protect

Part Name(s) : V826532K04S V826532K04SXTG-A1 V826532K04SXTG-B0 V826532K04SXTG-B1 Mosel-Vitelic
Mosel Vitelic Corporation
Description : 2.5 VOLT 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE View

Description
The V826532K04S memory MODULE is organized 33,554,432 x 64 bits in a 184 pin memory MODULE. The 32M x 64 memory MODULE uses 16 Mosel-Vitelic 16M x 8 DDR SDRAM. The x64 MODULEs are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 184 Pin UNBUFFERED 33,554,432 x 64 bit Organization DDR SDRAM MODULEs
■ Utilizes High Performance 16M x 8 DDR SDRAM in TSOPII-66 Packages
■ Single +2.5V (± 0.2V) Power Supply
■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are SSTL-2 Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Presence Detect (SPD)
■ DDR SDRAM Performance

Part Name(s) : HYS64V16220GU HYS64V16220GU-10 HYS64V16220GU-8 HYS64V16220GU-8B HYS64V8200GU HYS64V8200GU-10 HYS64V8200GU-8 HYS64V8200GU-8B HYS72V16220GU HYS72V16220GU-10 HYS72V16220GU-8 HYS72V8200GU HYS72V8200GU-10 HYS72V8200GU-8 PC66-222-920 Infineon
Infineon Technologies
Description : 3.3 V 8M 64/72-Bit 1 Bank SDRAM MODULE, 3.3 V 16M 64/72-Bit 2 Bank SDRAM MODULE View

3.3 V 8M × 64/72-Bit 1 Bank SDRAM MODULE
3.3 V 16M × 64/72-Bit 2 Bank SDRAM MODULE
168 pin UNBUFFERED DIMM MODULEs

The HYS 64(72)8200 and HYS 64(72)16220 are industry standard 168-pin 8-byte Dual in-line Memory MODULEs (DIMMs) which are organized as 8M × 64, 8M × 72 in 1 bank and 16M × 64 and 16M × 72 in two banks high speed memory arrays designed with 64M Synchronous DRAMs (SDRAMs) for non-parity and ECC applications. The DIMMs use -8 and -8B speed sort 8M 8 SDRAM devices in TSOP-54 packages to meet the PC100 requirement. MODULEs which use -10 parts are suitable for PC66 applications only. Decoupling capacitors are mounted on the PC board. The PC board design is according to INTEL’s PC SDRAM Rev. 1.0 MODULE specification.

• 168 Pin PC100-compatible UNBUFFERED 8 Byte Dual-In-Line SDRAM MODULEs for PC main memory applications
• 1 bank 8M × 64, 8M × 72 and 2 bank 16M × 64, 16M × 72 organization
• Optimized for byte-write non-parity or ECC applications
• JEDEC standard Synchronous DRAMs (SDRAM)
• Fully PC board layout compatible to INTEL’s Rev. 1.0 MODULE specification
• Single + 3.3 V (± 0.3 V ) power supply
• Programmable CAS Latency, Burst Length and Wrap Sequence (Sequential & Interleave)
• Auto Refresh (CBR) and Self Refresh
• Decoupling capacitors mounted on substrate
• All inputs, outputs are LVTTL compatible
• Serial Presence Detect with E2PROM
• Utilizes 8M × 8 SDRAMs in TSOPII-54 packages
• 4096 refresh cycles every 64 ms
• 133.35 mm × 31.75 mm × 4.00 mm card size with gold contact pads

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